Extruded Heatsinks
Extruded heat sinks, also known as extruded aluminium heat sinks, are both visually appealing and lightweight, providing exceptional heat dissipation and energy-saving properties. Their production process involves heating aluminium ingots to between 520 and 540℃ before allowing the molten aluminium to flow under high pressure through a heat sink extrusion mould with grooves. This forms the extruded heat sink material, which, after cutting and processing, creates the familiar extruded aluminium heat sinks. Due to the ease of implementation and relatively low equipment costs, aluminium heat sinks have become highly popular. AL6063 is a widely-used material for its excellent thermal conductivity and machinability.
Aluminium extrusion heat sinks are often utilised in high-power systems. Leveraging well-established technology, Setolic can offer dependable natural convection environment solutions. Complex heat sink structures can be created by extruding aluminium through a suitable die, producing intricate fins that increase surface area while decreasing both cost and processing time.
1) Features: By employing aluminium extrusion technology, the desired profile is formed before undergoing machining processes such as cutting, deburring, CNC milling, drilling, tapping, polishing, surface finishing, assembly, and packaging.
2) Advantages:
– More efficient and cost-effective compared to mechanical processing
– Custom shapes and sizes available in a wide variety
– Outstanding thermal performance
3) Capability: Maximum extrusion size: W550 x H150mm.
Skived Fin Heat Sinks
Skived fin heatsinks are a type of thermal management solution that uses thin, closely spaced fins cut from a single piece of material, typically metal such as aluminium or copper. The fins are manufactured through a skiving process, which involves cutting, bending and spreading the fins using specialised tools. This results in a lightweight and efficient heatsink with high surface area for effective heat dissipation.
Skived fin heatsinks are suited for applications that require effective cooling in space-constrained environments, such as electronics and computer systems. They are commonly used in high-performance CPUs, GPUs, and power supply units (PSUs). Other applications include LED lighting, automotive systems, telecommunications equipment, and medical devices – essentially any situation where efficient heat removal is crucial for optimal performance and component longevity.
Soldered Heatsinks
Soldered heatsinks function by efficiently transferring heat away from a heat-producing component to the heatsink. They work by attaching the heatsink directly onto the component using solder, which creates a durable bond and provides excellent thermal conductivity. Soldered heatsinks help maintain optimal temperatures in electronic devices, improving their overall performance and longevity.
The applications of soldered heatsinks are suited for areas where high thermal conductivity is critical. These areas include computer CPUs, GPUs, power supplies, LED lighting systems, and various other electronics that generate significant amounts of heat during operation. They are particularly useful in situations where space constraints and long-term reliability are essential factors, such as aerospace and defence systems, telecommunications equipment, and high-performance computing hardware.
Liquid Cold Plates
Liquid cold plates function by transferring heat from a component, such as an electronic device, to a circulating liquid. This is achieved through a flat, thermally
conductive plate that is in direct contact with the component. The liquid within the system absorbs the heat and carries it away, ensuring the component remains at an optimal temperature.
Typical liquids used in liquid cold plates include water, ethylene glycol-water mixtures, dielectric fluids like fluorocarbons, and high-thermal-conductivity oils. These liquids are chosen for their thermal conductivity properties and compatibility with the components being cooled.
Liquid cold plates are suited for applications where high-performance cooling and precise temperature control are required. They are often utilised in electronics cooling systems, laser diode cooling, high power density devices, medical equipment, power electronics like converters and inverters, supercomputers, and hybrid-electric vehicle batteries.
